Designed for high-volume PCBA production, the YSM-350 offers superior temperature stability and optimized solder wave performance. Its nitrogen-assisted process improves wetting characteristics and minimizes common defects such as bridging, icicles, and insufficient solder coverage. This makes it ideal for applications requiring stable, repeatable soldering results, including automotive control units, industrial power boards, LED drivers, and consumer electronics assemblies.<\/p>\n
C\u00e1i \u0110\u1ec3 bi\u1ebft th\u00eam th\u00f4ng tin v\u1ec1 M\u00e1y H\u00e0n S\u00f3ng Nit\u01a1 PCB YSM-350, vui l\u00f2ng g\u1eedi email \u0111\u1ebfn<\/strong> is engineered for efficient operation with features that support continuous production. Its energy-optimized heating system, precise conveyor control, and high-performance pump ensure uniform solder delivery across various PCB sizes and component densities. The nitrogen environment also reduces solder dross formation, lowering material waste and decreasing overall maintenance requirements.<\/p>\n With a robust structure and user-friendly control interface, the \u0110\u1ec3 bi\u1ebft th\u00eam th\u00f4ng tin v\u1ec1 M\u00e1y H\u00e0n S\u00f3ng Nit\u01a1 PCB YSM-350, vui l\u00f2ng g\u1eedi email \u0111\u1ebfn<\/strong> integrates seamlessly into automated manufacturing lines. It helps factories enhance productivity, improve first-pass yield, and maintain consistent quality standards in demanding electronic assembly environments.<\/p>\n \n \n \n \n C\u00e1i YSM-350 Nitrogen Wave Soldering Machine<\/strong> provides a stable, oxidation-free soldering environment essential for high-reliability automotive THT assemblies. It ensures consistent solder joint quality for critical modules such as ECUs, BMS boards, lighting drivers, and sensor PCBs.<\/p>\n Under nitrogen protection, the YSM-350 improves wetting, prevents bridging, and delivers uniform joints for connectors, coils, relays, and high-current terminals\u2014meeting long-term vibration and thermal cycling requirements.<\/p>\n Its enhanced preheating and efficient nitrogen atmosphere ensure proper solder flow on thick-copper automotive boards used in power modules, engine controllers, and LED lighting units.<\/p>\n Nitrogen significantly decreases solder dross, stabilizes temperature, and extends maintenance intervals\u2014ideal for continuous automotive production lines.<\/p>\n Real-time monitoring of temperature, nitrogen levels, and wave parameters supports IATF 16949 quality management and OEM audit requirements.<\/p>\n The YSM-350 connects to fluxers, preheaters, conveyors, AOI, and MES systems, enabling efficient automated THT soldering in automotive factories.<\/p>\n The YSM-350 ensures high-reliability, low-defect, and fully traceable THT soldering, perfectly suited for automotive ECUs, BMS, power electronics, lighting modules, and safety-critical control units.<\/p>\n <\/p>\n <\/p>\n![\"PCB](\"https:\/\/esmte.com\/wp-content\/uploads\/2025\/12\/11-35-scaled.webp\")
<\/p>\nHow the PCB Nitrogen Wave Soldering Machine YSM-350 Is Used in Automotive Electronics Factories<\/strong><\/h2>\n
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Summary<\/strong><\/h3>\n
![\"Wave](\"https:\/\/esmte.com\/wp-content\/uploads\/2025\/12\/Wave-Solder.webp\")
<\/p>\nTh\u00f4ng s\u1ed1 k\u1ef9 thu\u1eadt<\/h2>\n
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\n Ng\u01b0\u1eddi m\u1eabu<\/td>\n YSM-350<\/td>\n YSM-450<\/td>\n<\/tr>\n \n K\u00edch th\u01b0\u1edbc (mm)<\/td>\n 4420X1420X1750<\/td>\n 4420X1520X1750<\/td>\n<\/tr>\n \n Ngu\u1ed3n \u0111i\u1ec7n<\/td>\n 3P5W,380\/220V 50Hz<\/td>\n 3P5W,380\/220V 50Hz<\/td>\n<\/tr>\n \n Startup Power<\/td>\n 33kw<\/td>\n 33kw<\/td>\n<\/tr>\n \n Operation Power<\/td>\n 8kw<\/td>\n 8kw<\/td>\n<\/tr>\n \n H\u1ec7 th\u1ed1ng \u0111i\u1ec1u khi\u1ec3n<\/td>\n PC+PLC<\/td>\n PC+PLC<\/td>\n<\/tr>\n \n Preheating Zone<\/td>\n 3<\/td>\n 3<\/td>\n<\/tr>\n \n Preheating Length<\/td>\n 1800mm<\/td>\n 1800mm<\/td>\n<\/tr>\n \n Preheating Temp.<\/td>\n (Room Temperature)-250\u2103<\/span><\/td>\n (Room Temperature)-250\u2103<\/span><\/td>\n<\/tr>\n \n PCB Width(mm)<\/td>\n 50-350mm<\/td>\n 50-450mm<\/td>\n<\/tr>\n \n Finger<\/td>\n Spring Pressing Finger (Standard);<\/td>\n<\/tr>\n \n Option:Spring Pressing Finger, Duck Mouth Finger<\/td>\n<\/tr>\n \n Solder Pot Capacity<\/td>\n Lead-free 500kg<\/td>\n<\/tr>\n \n Machine Weight(kg)<\/td>\n Approx.1800kg<\/td>\n Approx.2100kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n