The machine features a multi-stage cleaning system that combines brushing, suction, and optional ultrasonic cleaning to remove residues effectively without damaging delicate nozzle tips. Its programmable cleaning cycles allow customization for different nozzle sizes and types, ensuring thorough cleaning across a wide range of SMT components. By preventing residue buildup, the YC-665 enhances component placement accuracy, reduces defects, and improves overall production yield.<\/p>\n
\u0110\u01b0\u1ee3c thi\u1ebft k\u1ebf \u0111\u1ec3 t\u00edch h\u1ee3p li\u1ec1n m\u1ea1ch v\u00e0o c\u00e1c d\u00e2y chuy\u1ec1n SMT, SMT\u00a0Nozzle Cleaning Machine YC-665<\/strong> operates automatically with minimal human intervention. Its smart handling system manages loading, cleaning, and unloading, maintaining consistent cleaning performance even in high-volume operations. The compact footprint and user-friendly interface make it suitable for both small workshops and large-scale manufacturing facilities.<\/p>\n Compatible with nozzles used in consumer electronics, automotive PCBs, and industrial control boards, the SMT\u00a0Nozzle Cleaning Machine YC-665<\/strong> is a versatile solution for modern SMT production. By providing repeatable, high-quality cleaning, it prolongs nozzle life, stabilizes production processes, and supports the manufacture of reliable, high-performance electronic devices.<\/p>\n Precision Nozzle Cleaning<\/strong> V\u1eadn h\u00e0nh ho\u00e0n to\u00e0n t\u1ef1 \u0111\u1ed9ng<\/strong> Multi-Stage Cleaning Technology<\/strong> Chu tr\u00ecnh l\u00e0m s\u1ea1ch c\u00f3 th\u1ec3 l\u1eadp tr\u00ecnh<\/strong> Kh\u1ea3 n\u0103ng t\u01b0\u01a1ng th\u00edch v\u1edbi d\u00e2y chuy\u1ec1n SMT t\u1ed1c \u0111\u1ed9 cao<\/strong> Enhanced Nozzle Longevity<\/strong> <\/p>\n![\"SMT](\"https:\/\/esmte.com\/wp-content\/uploads\/2025\/12\/11-12.webp\")
<\/p>\nC\u00e1c t\u00ednh n\u0103ng ch\u00ednh<\/h3>\n
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The YC-665 efficiently removes solder paste residues, dust, and micro-debris from SMT pick-and-place nozzles, ensuring accurate component placement and stable soldering quality.<\/p>\n<\/li>\n
Automated loading, cleaning, and unloading reduce manual handling, minimize human error, and maintain consistent production efficiency.<\/p>\n<\/li>\n
Combines brushing, suction, and optional ultrasonic cleaning to thoroughly clean nozzles without causing damage to delicate tips.<\/p>\n<\/li>\n
Customizable cycles allow operators to adjust cleaning parameters for different nozzle sizes and types, ensuring optimal cleaning performance.<\/p>\n<\/li>\n
Designed for integration into high-volume SMT production lines, the YC-665 maintains cleaning consistency without slowing down the workflow.<\/p>\n<\/li>\n
Regular and precise cleaning prevents residue buildup, extending nozzle lifespan and improving the overall reliability of SMT pick-and-place operations.<\/p>\n<\/li>\n<\/ul>\nTh\u00f4ng s\u1ed1 k\u1ef9 thu\u1eadt<\/h2>\n
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\n Ng\u01b0\u1eddi m\u1eabu<\/td>\n YC-665<\/td>\n<\/tr>\n \n Cung c\u1ea5p kh\u00f4ng kh\u00ed<\/td>\n 0,5~0,7 MPa<\/td>\n<\/tr>\n \n Ngu\u1ed3n \u0111i\u1ec7n<\/td>\n 17L<\/td>\n<\/tr>\n \n Clean liquid<\/td>\n Purified water or DI water<\/td>\n<\/tr>\n \n Th\u1eddi gian d\u1ecdn d\u1eb9p<\/td>\n 2~3min<\/td>\n<\/tr>\n \n Th\u1eddi gian kh\u00f4<\/td>\n 1~3min<\/td>\n<\/tr>\n \n Jet pressure<\/td>\n \u22640.55Mpa<\/td>\n<\/tr>\n \n Water consumption<\/td>\n \u2264150cc\/hour<\/td>\n<\/tr>\n \n Nozzle range<\/td>\n Min 01005~Max inner diameter\u00a0\uffe02.0mm<\/td>\n<\/tr>\n \n Jig Spec<\/td>\n I.C.T-24:Small nozzle 24 holes \/big nozzle 12 holes<\/td>\n<\/tr>\n \n I.C.T-36:Small nozzle 36 holes \/big nozzle 12 holes<\/td>\n<\/tr>\n \n K\u00edch th\u01b0\u1edbc m\u00e1y<\/td>\n L665 x W555 x H475(mm)<\/td>\n<\/tr>\n \n Tr\u1ecdng l\u01b0\u1ee3ng m\u00e1y<\/td>\n 40KG<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n