Профессиональный SMT вакуумный загрузчик печатных плат

Описание: Профессиональный SMT вакуумный загрузчик печатных плат Предсказуемая и равномерная нагрузка повышает стабильность линии, помогая поддерживать высокую производительность и надежную отслеживаемость в производстве смартфонов.

Минимальный объем заказа: 1 шт.

Срок выполнения заказа: 15 дней

Введение

Он Профессиональный SMT вакуумный загрузчик печатных плат manages the introduction of PCBs into SMT lines with controlled motion, safeguarding fragile components. Its vacuum-based approach reduces vibration and impact on BGAs and QFNs, protecting solder joints and delicate assemblies throughout the loading process. This careful handling supports accurate operations on pick-and-place, reflow, and inspection equipment in smartphone manufacturing.

The system is adaptable to multiple PCB formats and thicknesses, allowing manufacturers to switch between models efficiently. Quick adjustments accommodate different layouts, supporting flexible production schedules and high-volume smartphone assembly. Smooth coordination with downstream automated processes helps maintain an organized material flow, reduces potential disruptions, and enhances overall line performance.

Reducing manual intervention, the Профессиональный SMT вакуумный загрузчик печатных плат decreases operator workload while improving the safety of sensitive boards. It ensures reliable PCB transfer and predictable operation across production batches. By enhancing line stability and minimizing handling errors, the loader becomes a key component for manufacturers seeking improved throughput, product quality protection, and streamlined SMT assembly operations.

How the Professional SMT Vacuum Type PCB Loader YV-250 is Applied in Smartphone Electronics Factories

  • Controlled Board Placement for Sensitive Devices
    Он Профессиональный SMT вакуумный загрузчик печатных плат ensures each PCB enters the production line with precise alignment, crucial for high-density smartphone electronics.

  • Minimizing Component Stress
    The vacuum mechanism reduces mechanical impact, protecting fragile BGA and QFN packages during the loading process.

  • Improved Line Efficiency
    Consistent PCB feeding reduces stoppages and bottlenecks, ensuring smooth synchronization with downstream inspection and assembly processes.

  • Flexible Production Adaptation
    Handles PCBs of varying sizes and layouts, making it ideal for multi-model smartphone production environments.

  • Enhanced Operator Safety and Workflow
    Reduces repetitive manual handling, allowing staff to focus on monitoring and quality control rather than routine board loading.

  • Support for Quality Control and Traceability
    Predictable and uniform loading improves line consistency, helping maintain high yield and reliable traceability in smartphone manufacturing.

Технические характеристики

Модель YV-250 YV-330 YV-390 YV-460
Размеры (мм) 1800*865*1250 2220*945*1250 2450*1110*1250 2450*1250*1250
PCB Size(mm) 50*80-330*250 50*80-445*330 50*80-530*390 50*80-530*460
Rack Size(mm) 355*320*563 460*400*563 535*460*563 535*530*563
No. of Magazine Upper Conveyor:1magazine; Lower Conveyor: 1magazine
Indexing Pitch 10 . 20 . 30 . 40mm or specify
Maximum PCBs Capacity 400pcs(0.6mm thick PCB)
Cycle Time Approx. 12 seconds or specify
Источник питания AC 1P 110V/220V; Max 300VA
Air Pressure 4-6bar, 30ltr/min Max
Transport Height 900±20mm(or customized)
Transport Direction From left to right or right to left
Weight(KG) 200 240 280 320

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