Введение
Он SMT Nozzle Cleaning Machine is a specialized solution designed to ensure the optimal performance of SMT pick-and-place nozzles in modern electronics manufacturing. In high-speed production environments, nozzles can accumulate solder paste, dust, or other fine residues that compromise component placement accuracy. This machine addresses these challenges with a fully automated cleaning process that maintains nozzle precision and reduces defects across all production runs.
Equipped with precision cleaning mechanisms, the system removes micro-debris efficiently without damaging the nozzle tip. Its multi-stage cleaning design combines controlled brushing, suction, and optional ultrasonic action, delivering thorough results for various nozzle types and sizes. By preventing residue buildup, it enhances the reliability of component placement and minimizes the risk of misalignment or soldering defects.
Designed for seamless integration into SMT production lines, the Nozzle Cleaning Machine operates automatically with minimal human intervention. Smart handling and programmable cleaning cycles ensure consistency, allowing manufacturers to maintain high-speed operations while safeguarding the quality of every pick-and-place cycle. Its compact footprint and user-friendly interface make it suitable for both small workshops and large-scale factories.
Он SMT Nozzle Cleaning Machine is compatible with nozzles used in consumer electronics, automotive boards, industrial control PCBs, and other precision assemblies. By providing stable, repeatable cleaning performance, it extends nozzle lifespan, enhances overall equipment efficiency, and supports consistent high-quality manufacturing. The Nozzle Cleaning Machine is an essential tool for electronics manufacturers aiming to optimize SMT line productivity and reliability.

Основные характеристики
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High-Precision Nozzle Cleaning
Effectively removes solder paste residues, dust, and micro-debris from SMT pick-and-place nozzles, ensuring consistent component placement and reliable soldering quality. -
Automated Operation
Fully automated loading, cleaning, and unloading processes reduce manual handling, minimize human error, and stabilize production efficiency. -
Многоступенчатая система очистки
Combines brushing, suction, and optional ultrasonic cleaning to achieve thorough results without damaging delicate nozzle tips. -
Smart Process Monitoring
Equipped with sensors and programmable cycles to track cleaning performance in real time, allowing adjustments for optimal cleaning outcomes. -
Compatibility with Various Nozzle Types
Supports multiple nozzle sizes and designs used in consumer electronics, automotive PCBs, and industrial boards, making it versatile for different production lines. -
Improved Equipment Longevity
Regular and precise cleaning reduces wear and tear on nozzles, prolonging their lifespan and maintaining consistent SMT line productivity.
Технические характеристики
| Модель | YC-665 |
| Подача воздуха | 0,5~0,7 МПа |
| Источник питания | 17L |
| Чистая жидкость | Очищенная вода или деионизированная вода |
| Время уборки | 2–3 мин. |
| сухое время | 1–3 мин. |
| Струйное давление | ≤0,55 МПа |
| Потребление воды | ≤150 мл/час |
| Диапазон сопла | Min 01005~Max inner diameter ¢2.0mm |
| Технические характеристики приспособления | I.C.T-24:Small nozzle 24 holes /big nozzle 12 holes |
| I.C.T-36:Small nozzle 36 holes /big nozzle 12 holes | |
| Размер машины | Д665 x Ш555 x В475 (мм) |
| Вес машины | 40 кг |
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