The machine features a multi-stage cleaning system that combines brushing, suction, and optional ultrasonic cleaning to remove residues effectively without damaging delicate nozzle tips. Its programmable cleaning cycles allow customization for different nozzle sizes and types, ensuring thorough cleaning across a wide range of SMT components. By preventing residue buildup, the YC-665 enhances component placement accuracy, reduces defects, and improves overall production yield.<\/p>\n
Designed for seamless integration into SMT lines, the SMT\u00a0Nozzle Cleaning Machine YC-665<\/strong> operates automatically with minimal human intervention. Its smart handling system manages loading, cleaning, and unloading, maintaining consistent cleaning performance even in high-volume operations. The compact footprint and user-friendly interface make it suitable for both small workshops and large-scale manufacturing facilities.<\/p>\n Compatible with nozzles used in consumer electronics, automotive PCBs, and industrial control boards, the SMT\u00a0Nozzle Cleaning Machine YC-665<\/strong> is a versatile solution for modern SMT production. By providing repeatable, high-quality cleaning, it prolongs nozzle life, stabilizes production processes, and supports the manufacture of reliable, high-performance electronic devices.<\/p>\n Precision Nozzle Cleaning<\/strong> Opera\u00e7\u00e3o totalmente automatizada<\/strong> Multi-Stage Cleaning Technology<\/strong> Ciclos de limpeza program\u00e1veis<\/strong> Compatibilidade com linhas SMT de alta velocidade<\/strong> Enhanced Nozzle Longevity<\/strong> <\/p>\n![\"SMT](\"https:\/\/esmte.com\/wp-content\/uploads\/2025\/12\/11-12.webp\")
<\/p>\nPrincipais caracter\u00edsticas<\/h3>\n
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The YC-665 efficiently removes solder paste residues, dust, and micro-debris from SMT pick-and-place nozzles, ensuring accurate component placement and stable soldering quality.<\/p>\n<\/li>\n
Automated loading, cleaning, and unloading reduce manual handling, minimize human error, and maintain consistent production efficiency.<\/p>\n<\/li>\n
Combines brushing, suction, and optional ultrasonic cleaning to thoroughly clean nozzles without causing damage to delicate tips.<\/p>\n<\/li>\n
Customizable cycles allow operators to adjust cleaning parameters for different nozzle sizes and types, ensuring optimal cleaning performance.<\/p>\n<\/li>\n
Designed for integration into high-volume SMT production lines, the YC-665 maintains cleaning consistency without slowing down the workflow.<\/p>\n<\/li>\n
Regular and precise cleaning prevents residue buildup, extending nozzle lifespan and improving the overall reliability of SMT pick-and-place operations.<\/p>\n<\/li>\n<\/ul>\nEspecifica\u00e7\u00f5es<\/h2>\n
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\n Modelo<\/td>\n YC-665<\/td>\n<\/tr>\n \n Abastecimento de ar<\/td>\n 0,5~0,7Mpa<\/td>\n<\/tr>\n \n Fonte de energia<\/td>\n 17L<\/td>\n<\/tr>\n \n L\u00edquido limpo<\/td>\n \u00c1gua purificada ou \u00e1gua deionizada<\/td>\n<\/tr>\n \n Hora da limpeza<\/td>\n 2 a 3 minutos<\/td>\n<\/tr>\n \n Tempo de secagem<\/td>\n 1 a 3 minutos<\/td>\n<\/tr>\n \n Press\u00e3o do jato<\/td>\n \u22640,55Mpa<\/td>\n<\/tr>\n \n Consumo de \u00e1gua<\/td>\n \u2264150 cc\/hora<\/td>\n<\/tr>\n \n Gama de bicos<\/td>\n Di\u00e2metro interno m\u00ednimo 01005 ~ Di\u00e2metro interno m\u00e1ximo \uffe02,0 mm<\/td>\n<\/tr>\n \n Especifica\u00e7\u00f5es do gabarito<\/td>\n ICT-24: Bocal pequeno com 24 furos \/ Bocal grande com 12 furos<\/td>\n<\/tr>\n \n ICT-36: Bocal pequeno com 36 furos \/ Bocal grande com 12 furos<\/td>\n<\/tr>\n \n Tamanho da m\u00e1quina<\/td>\n C665 x L555 x A475 (mm)<\/td>\n<\/tr>\n \n Peso da m\u00e1quina<\/td>\n 40 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n