SMT Tray Cleaning Machine YC-1000

Descrição: O SMT Máquina de limpeza de bandejas YC-1000 is engineered to deliver fast, consistent, and high-precision cleaning for SMT, semiconductor, and electronics handling trays. Its optimized brushing and airflow extraction system effectively removes dust, fibers, and micro-contaminants without damaging the tray structure. Designed for stable operation and easy maintenance, the YC-1000 supports multiple tray sizes and high-throughput production environments. It helps manufacturers maintain clean material flow, reduce contamination risks, and ensure reliable quality throughout the assembly process.

Quantidade mínima para encomenda: 1 unidade

Prazo de entrega: 15 dias

Introdução

O SMT Máquina de limpeza de bandejas YC-1000 is designed to meet the increasing cleanliness standards of modern SMT, semiconductor, and precision assembly environments. Its advanced cleaning module integrates soft-contact brushing, guided airflow, and high-efficiency particle extraction to remove dust, fibers, and residual contaminants from trays without causing abrasion or deformation. With its stable mechanical structure and optimized processing path, the YC-1000 ensures uniform cleaning results even under long-duration, high-volume operation.

To support diverse manufacturing workflows, the SMT Máquina de limpeza de bandejas YC-1000 accommodates a wide range of tray sizes and materials, making it adaptable to mixed-model production lines. Its fully automated loading, cleaning, and unloading sequence minimizes manual intervention and significantly improves operational efficiency. The enclosed cleaning zone and well-controlled exhaust system also help maintain cleaner environments, especially in cleanroom-level processes.

Maintenance is simplified through tool-free access points, durable components, and long-life consumables, allowing technicians to perform quick checks and replacements with minimal downtime. By combining reliable performance, easy integration, and superior contamination control, the SMT Máquina de limpeza de bandejas YC-1000 provides manufacturers with a highly efficient and consistent solution for improving product yield and maintaining cleaner production standards.

SMT Tray Cleaning Machine

Principais características

  • Enhanced Multi-Stage Cleaning System
    The YC-1000 utilizes a coordinated combination of precision brushing, controlled airflow sweeping, and high-efficiency extraction to remove layered dust and micro-particles from trays. This multi-stage approach ensures thorough cleanliness, making it suitable for sensitive SMT and semiconductor applications.

  • Adaptive Tray Size Handling
    Engineered with an adjustable alignment mechanism, the machine supports a wide spectrum of tray formats without requiring complex changeovers. This flexibility enables operators to switch between different product types quickly, maintaining smooth flow in dynamic production lines.

  • Stable and Repeatable Cleaning Quality
    With reinforced structural integrity and carefully balanced cleaning pressure, the YC-1000 delivers uniform results across every cycle. Its consistent performance helps manufacturers reduce contamination risks and achieve predictable quality in high-volume operations.

  • High-Throughput Automation
    The machine integrates automated feeding, cleaning, and discharge functions to streamline workflow. This reduces manual handling, accelerates tray turnover, and enhances productivity for facilities operating under tight cycle-time requirements.

  • Low-Maintenance Architecture
    Designed with user convenience in mind, the YC-1000 features easy-access panels, robust wear-resistant components, and simplified inspection paths. These elements help reduce service time and extend equipment life in demanding production environments.

  • Cleanroom-Compatible Operation
    An enclosed cleaning chamber combined with an efficient dust-capture system minimizes particle dispersion. This ensures that tray cleaning contributes positively to overall cleanliness management, supporting high-end manufacturing processes that require controlled environments.

 

 

Especificações

Item YC-1000
Tamanho do cesto de limpeza Φ1000mm x A 200mm. Opção de tamanho especial.
Unidade de pulverização Φ1000mm x A 200mm. Opção de tamanho especial.
Unidade de pulverização Lado superior/inferior/frontal, pulverização em 720° em toda a volta
Sistema de filtragem de 3 níveis Filtros de 1 mm / 50 µm / 20 µm
Pressão do ar comprimido 0,5~0,7Mpa
Capacidade do tanque limpo 80L
Temperatura da água de enxágue Temperatura ambiente ~80
temperatura do calor do ar quente Temperatura ambiente ~32°C
Potência limpa da bomba 2,2 kW
Poder de detergente de limpeza 9 kW
Potência do soprador de ar 4,0 kW
Fonte de energia 3 P, CA 380 V, 50/60 Hz, 33 kW
Tamanho da máquina C1380 x L2100 x A1400 (mm)

 

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