Introdução
O SMT Máquina de limpeza de bandejas is engineered to meet the stringent cleanliness demands of modern SMT and semiconductor environments, ensuring every tray re-enters production in a contamination-free state. Built with a robust mechanical structure and a precisely aligned cleaning module, the tray cleaning machine delivers stable performance even under continuous operation. Its automated workflow significantly reduces manual labor, shortens preparation time, and improves overall line efficiency.
At the core of the system is an intelligent dust-extraction mechanism that combines soft-contact brushing, controlled airflow, and fine-particle suction to remove debris without scratching or deforming trays. The SMT Máquina de limpeza de bandejas also supports a wide range of tray dimensions, making it compatible with diverse materials and applications across electronics assembly, component packaging, and cleanroom handling.
Designed with convenient maintenance in mind, the SMT Máquina de limpeza de bandejas features tool-free access and long-life consumables, helping users minimize downtime. With its focus on consistent cleaning quality, reliability, and operational simplicity, the tray cleaning machine serves as a practical solution for manufacturers seeking to improve product yield and maintain cleaner production processes.

Principais características
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Precision Particle Removal
The machine integrates controlled airflow, soft-contact brushing, and targeted suction to remove fine dust, fibers, and micro-debris without damaging tray surfaces, ensuring stable cleanliness for sensitive SMT and semiconductor applications. -
Wide Tray Compatibility
Designed to accommodate various tray sizes and materials, it supports rapid changeover between models, enabling flexible use in mixed-production environments and reducing downtime in high-volume factories. -
Consistent Cleaning Performance
Equipped with a rigid structure and an optimized cleaning path, it maintains uniform force and repeatable cleaning quality, helping manufacturers achieve reliable contamination control throughout the entire process. -
Automated Workflow Efficiency
Its fully automatic feeding, cleaning, and output sequence minimizes manual handling. This boosts line throughput, reduces labor requirements, and keeps production running smoothly in continuous operations. -
Design de baixa manutenção
Featuring durable components, easy-access panels, and long-life consumables, the machine simplifies routine service. Operators can perform quick inspections and replacements with minimal interruption. -
Cleanroom-Friendly Operation
The enclosed cleaning zone and efficient dust-extraction system reduce airborne particles, supporting cleaner working environments and improving overall product yield for precision manufacturing lines.



Especificações
| Item | YC-1000 |
| Tamanho do cesto de limpeza | Φ1000mm x A 200mm. Opção de tamanho especial. |
| Unidade de pulverização | Φ1000mm x A 200mm. Opção de tamanho especial. |
| Unidade de pulverização | Lado superior/inferior/frontal, pulverização em 720° em toda a volta |
| Sistema de filtragem de 3 níveis | Filtros de 1 mm / 50 µm / 20 µm |
| Pressão do ar comprimido | 0,5~0,7Mpa |
| Capacidade do tanque limpo | 80L |
| Temperatura da água de enxágue | Temperatura ambiente ~80℃ |
| temperatura do calor do ar quente | Temperatura ambiente ~32°C℃ |
| Potência limpa da bomba | 2,2 kW |
| Poder de detergente de limpeza | 9 kW |
| Potência do soprador de ar | 4,0 kW |
| Fonte de energia | 3 P, CA 380 V, 50/60 Hz, 33 kW |
| Tamanho da máquina | C1380 x L2100 x A1400 (mm) |
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