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BGA High Quality SMT Unloading Machine YBU-120
Opis: BGA High Quality SMT Unloading Machine YBU-120 is engineered to provide precise and consistent PCB discharge in modern SMT production lines. Its advanced unloading mechanism ensures that boards with sensitive BGA components are transferred smoothly to inspection, testing, or storage stations, minimizing the risk of misalignment or component stress. Capable of handling multiple PCB sizes and configurations, the machine supports flexible manufacturing setups. By automating the unloading process, it reduces dependency on manual labor, enhances workflow predictability, and helps manufacturers maintain high-quality output while optimizing line throughput and productivity.
Minimalna ilość zamówienia: 1 szt.
Czas realizacji zamówienia: 15 dni
Wstęp
Ten BGA High Quality SMT Unloading Machine YBU-120 is designed to enhance PCB handling precision at the final stage of SMT lines. Sensitive BGA assemblies are transferred with careful motion control, preventing stress or accidental misplacement. This ensures that boards reach inspection, testing, or storage areas in optimal condition, supporting consistent production standards and downstream efficiency.
The machine supports multiple board types and production configurations, providing versatility for factories manufacturing diverse electronics, from smart home devices to medical equipment. Its adjustable parameters allow operators to accommodate different PCB dimensions and weights without compromising process flow. The BGA High Quality SMT Unloading Machine YBU-120 can be easily integrated with other SMT equipment, promoting balanced operation across the production line and reducing process interruptions.
In commercial terms, the BGA High Quality SMT Unloading Machine YBU-120 contributes to improved operational stability and predictable output quality. Automated unloading reduces labor needs while maintaining consistent handling standards, protecting valuable components and supporting product reliability. Manufacturers gain measurable benefits in throughput performance, component safety, and production predictability, making this machine an essential component of modern automated electronics assembly lines.
How the BGA High Quality SMT Unloading Machine YBU-120 is Applied in Medical Electronics Factories
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Structured PCB Transfer After Reflow Processes
The YBU-120 manages precise board exit following soldering, ensuring controlled movement into inspection or cooling stages. -
Compatibility with Medical Device Control Boards
The machine accommodates PCBs used in imaging systems, patient monitoring devices, and laboratory equipment. -
Reduced Risk of Micro-Damage to BGA Packages
Controlled unloading paths help preserve solder joint integrity in high-value medical electronics assemblies. -
Improved Line Balance in Regulated Production Cells
Automated unloading reduces bottlenecks caused by manual board collection in medical SMT lines. -
Support for Traceable Manufacturing Workflows
Consistent unloading behavior aids in maintaining clear production records required by medical industry standards. -
Higher Equipment Utilization Across Extended Shifts
Reliable mechanical operation supports long-duration production runs common in medical electronics factories.
Specyfikacje
| Model | YBL-120 | YBU-120 |
| Wymiary (mm) | 1175*1000*1080 | 1175*1000*1080 |
| PCB Size(mm) | 80*50-330*120 | 80*50-330*120 |
| Rack Size(mm) | 50*80*100-300*150*400 | 50*80*100-300*150*400 |
| Circuit Board Thickness | 0,2-2,0 mm | |
| Time Feed PCB | 6.0-16sec(or customer specified) | |
| Zasilacz | AC220V±10V, 50/60HZ 450W | |
| Air Pressure | 4-6bar up to 10 liters per minute | |
| Transport Height | 900±20mm(or customized) | |
| Transport Direction | From left to right or right to left | |
| Weight(KG) | 240 | 245 |
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