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Układ gniazd DIMM dwukanałowych w produkcji elektroniki komunikacyjnej

Opis: Inteligentny podajnik z dwoma liniami do gniazd DIMM functions as an automated DIMM socket routing unit for communication electronics manufacturing. Its two parallel feeding paths accommodate separate streams of connector material, while individual drive and detection mechanisms regulate socket travel and output timing. The system prepares each DIMM Slot at a defined presentation position for automated insertion, reducing manual handling between component loading and PCB assembly. With a compact footprint and compatibility with established production cells, the feeder can support telecom server motherboard, network communication board, storage appliance, and industrial computing electronics lines.

Minimalna ilość zamówienia: 1 szt.

Czas realizacji zamówienia: 15 dni

Wstęp

Ten Inteligentny podajnik z dwoma liniami do gniazd DIMM joins an existing line rather than demanding a new one. Its compact frame occupies modest floor area, and its mounting and signal interfaces align with familiar automation platforms, so it can be provisioned alongside placement equipment already in service. Two independent feed channels let the unit scale with demand — a single lane for a modest build, both engaged for a heavier schedule, without a second purchase.

In operation, sockets are presented to the placement system through two parallel lanes, each with its own drive and detection, so a disturbance in one never reaches the other. Sockets progress from magazine to presentation point along a straight, guided path. When a build changes, the lanes are re-set for the new socket style, and the line resumes without a prolonged stoppage or re-engineering of the surrounding cell.

Deployment spans motherboard and server board assembly, memory module test lines, industrial computer manufacturing, network communication equipment production, storage appliance assembly, and electronics manufacturing service providers running mixed orders. It also fits lines producing add-in cards and workstation boards, where memory sockets are inserted after primary placement. Wherever an existing line needs dependable dual-stream socket provisioning, the unit slips into place and cooperates with what is already installed.

 

Intelligent Dual Line DIMM Slot Feeder

Inteligentny podajnik z dwoma liniami do gniazd DIMM

 

 

 

Intelligent Dual Line DIMM Slot Feeder for Advanced DIMM Slot Material Routing in Communication Electronics Factory

Ten Inteligentny podajnik z dwoma liniami do gniazd DIMM can serve as a dedicated component supply unit in telecom server motherboard production, where DIMM Slots must be delivered to a through-hole insertion station in a controlled sequence. DIMM sockets are first placed into the feeder according to the production order and component orientation. The machine receives these connectors as discrete mechanical parts, separates them from the incoming material flow, and transfers them toward two independent feeding routes. Each route provides controlled movement between the loading area and the presentation position, allowing the downstream insertion machine to obtain DIMM Slots without manual component picking.

Its dual-line architecture is particularly useful when telecom server boards contain multiple memory connector positions or when two motherboard variants are assembled within the same manufacturing area. The feeder can distribute DIMM Slot material through separate channels, while the control system manages release timing and component spacing. As each socket reaches the output area, its position is established for the insertion mechanism. This creates a defined handoff between component feeding and PCB insertion, reducing random orientation and unnecessary operator intervention during connector preparation.

In a communication electronics factory, the feeder can be applied to telecom server motherboard lines, network computing board lines, communication gateway motherboard lines, data communication equipment controller boards, and carrier-grade computing platforms. A typical process is tray or bulk material loading → dual-channel separation → guided transport → orientation control → output presentation → automated DIMM Slot insertion → through-hole soldering → AOI inspection → electrical verification. For telecom boards requiring several memory sockets, the two feeding routes provide a practical material-handling structure for repeated connector supply while maintaining a clear relationship between component preparation and motherboard assembly.

 

 

Specyfikacje

Model YN-D2109
Wymiary (dł. × szer. × wys.) Proszę zapoznać się z powyższym rysunkiem(Jednostka: mm)
Waga 162,5 kg
Operating Voltage 220 V prądu przemiennego
Wymagane zasilanie powietrzem 0,5 MPa
Moc maksymalna 800 W
Feed Speed 2,5 s/szt.
Operation Panel Ekran dotykowy Wecon
System sterowania Płyta sterująca Leisai
Kanał 2 kanały
Odpowiednia tacka Proszę zapoznać się z rysunkiem po prawej stronie
(Na jednej stronie można ułożyć 8 warstw materiału)
Material Kompatybilny zarówno z materiałami PTH, jak i SMT; obsługuje podawanie dwutorowe dla różnych materiałów
(Automatyczne wysunięcie tacy po wyczerpaniu materiału)

 

 

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