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High End SMT Automatic Folding Loader YF-330
설명: High End SMT Automatic Folding Loader YF-330 is designed to manage delicate PCBs in smart camera production with high accuracy and safety. Its automated folding and feeding mechanism reduces mechanical stress, protecting fragile sensors, connectors, and micro-ICs. The loader ensures that boards are delivered in correct alignment for placement machines, facilitating stable downstream assembly. By limiting human intervention, it improves line predictability, reduces errors, and maintains steady throughput. This system is particularly suitable for high-volume production of smart camera modules, supporting consistent quality, operational control, and enhanced protection of sensitive electronic components.
최소 주문 수량: 1개
소요 기간: 15일
소개
그만큼 High End SMT Automatic Folding Loader YF-330 is designed for reliable PCB handling in smart camera electronics manufacturing. Its automated folding system separates stacked boards gently, ensuring fragile components such as lenses, optical sensors, and fine-pitch ICs are not subjected to mechanical stress. Boards are delivered systematically to placement equipment, supporting accurate mounting and reducing assembly deviations.
그만큼 High End SMT Automatic Folding Loader YF-330 accommodates various board dimensions and thicknesses without affecting workflow, making it suitable for production lines with multiple camera models. Its smooth motion and consistent feed prevent unexpected stoppages, supporting uninterrupted operation and reliable line timing.
By limiting manual handling, the High End SMT Automatic Folding Loader YF-330 reduces contamination and operator-induced errors. Production lines achieve stable throughput, predictable assembly cycles, and reduced material waste. This loader provides smart camera manufacturers with a dependable and adaptable solution, ensuring orderly PCB handling, precise component delivery, and continuous, high-volume production.
How the High End SMT Automatic Folding Loader YF-330 is Applied in a Smart Camera Electronics Factory
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Controlled acceleration and deceleration
Folding mechanism applies steady motion to prevent sudden shocks to sensitive components. -
Safeguards optical sensors and micro-components
Reduces risk of damage to high-precision parts integral to smart camera performance. -
Maintains orderly board flow
Feeds PCBs sequentially to placement machines, ensuring systematic assembly without disruption. -
Supports automated inspection readiness
Boards are delivered in proper orientation for AOI and functional testing, improving quality assurance. -
Adaptable to high-mix production
Capable of handling varied product SKUs, including cameras with different PCB configurations. -
Reduces operational variability
Ensures consistent handling throughout shifts, supporting dependable assembly and fewer line disturbances.
명세서
| 모델 | YF-250 | YF-330 | YF-390 |
| 치수(mm) | 1850*855*1250 | 2185*935*1250 | 2320*994*1250 |
| PCB Size(mm) | 50*80-330*250 | 50*80-445*330 | 50*80-460*390 |
| Rack Size(mm) | 355*320*563 | 460*400*563 | 535*460*563 |
| No. of Magazine | Upper Conveyor:1magazine; Lower Conveyor: 1magazine | ||
| Indexing Pitch | 10 . 20 . 30 . 40mm or specify | ||
| Maximum PCBs Capacity | 400pcs(0.6mm thick PCB) | ||
| Cycle Time | Approx. 12 seconds or specify | ||
| Power Supply | AC 1P 110V/220V; Max 300VA | ||
| Air Pressure | 4-6bar, 30ltr/min Max | ||
| Transport Height | 900±20mm(or customized) | ||
| Transport Direction | From left to right or right to left | ||
| Weight(KG) | 190 | 220 | 260 |
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