소개
그만큼 BGA High Quality SMT Loading and Unloading Machine provides precise and secure PCB transfer throughout SMT production processes. Its controlled suction motion safeguards sensitive assemblies, including BGAs, QFNs, and high-density IC boards, from vibrations and mechanical stress. By ensuring steady, accurate movement, the machine contributes to consistent soldering quality and reduces defects associated with component misalignment.
The system operates in coordination with various SMT equipment, including solder paste printers, placement machines, reflow ovens, and inspection platforms. BGA 고품질 SMT 적재 및 하역 기계 ability to handle boards of differing sizes and weights allows for efficient processing of multiple product types on the same production line. This adaptability enhances operational reliability, reduces downtime during changeovers, and supports continuous line performance.
Real-time monitoring and programmable controls provide actionable insights into production workflow. Any irregularity in board positioning triggers immediate alerts, allowing operators to address issues before they impact yield. Automation of loading and unloading reduces labor dependence while improving repeatability, line stability, and overall efficiency. With consistent transfer performance, gentle handling of components, and seamless equipment integration, the BGA High Quality SMT Loading and Unloading Machine helps electronics manufacturers achieve dependable SMT operations and improved product quality.
How the BGA High Quality SMT Loading and Unloading Machine is applied in electronics manufacturing factories
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Controlled Linear Motion
Boards are transported with consistent speed and trajectory, ensuring precise placement and repeatable results across production cycles. -
Safe Handling of Sensitive ICs
BGAs and other fragile components are shielded from mechanical shock, reducing defects and material waste. -
Integrated SMT Line Support
The machine coordinates with upstream and downstream equipment, maintaining balanced operation across multiple production modules. -
다양한 PCB 호환성
Capable of handling varying board sizes and thicknesses, supporting diverse product assemblies without major adjustments. -
Automated Error Prevention
Onboard sensors detect misalignment or improper placement during transfer, triggering immediate corrective actions to maintain quality. -
Data-Driven Process Control
Digital interfaces provide real-time monitoring and analytics, enabling workflow optimization and enhanced production transparency.
명세서
| 모델 | YBL-120 | YBU-120 |
| 치수(mm) | 1175*1000*1080 | 1175*1000*1080 |
| PCB Size(mm) | 80*50-330*120 | 80*50-330*120 |
| Rack Size(mm) | 50*80*100-300*150*400 | 50*80*100-300*150*400 |
| Circuit Board Thickness | 0.2-2.0mm | |
| Time Feed PCB | 6.0-16sec(or customer specified) | |
| Power Supply | AC220V±10V, 50/60HZ 450W | |
| Air Pressure | 4-6bar up to 10 liters per minute | |
| Transport Height | 900±20mm(or customized) | |
| Transport Direction | From left to right or right to left | |
| Weight(KG) | 240 | 245 |
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For more information about the BGA 고품질 SMT 적재 및 하역 기계, 자세한 내용은 이메일을 보내주세요.
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