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자동 솔더 틴 분리기 YTS-850(3)

카테고리:

설명: 자동 솔더 틴 분리기 YTS-850(3) is an advanced automation system engineered to streamline PCB depaneling in high-volume SMT production environments. It precisely isolates individual boards from multi-board panels while applying minimal mechanical force, preserving delicate components and maintaining solder joint integrity. With its stable and controlled operation, the machine produces uniform, burr-free edges, ensuring boards are ready for downstream assembly, testing, or inspection. Optimized for integration into automated SMT lines, it enhances production efficiency, reduces manual labor, improves workplace safety, and delivers consistently high-quality PCB output for modern electronics manufacturing.

최소 주문 수량: 1개

소요 기간: 15일

소개

그만큼 자동 솔더 틴 분리기 YTS-850(3) is a cutting-edge depaneling solution engineered for modern electronics manufacturing, delivering precision, reliability, and operational efficiency in SMT production environments. Designed to process multi-board PCB panels, it isolates individual boards accurately while preserving structural integrity and preventing stress to sensitive components and solder joints.

Built with advanced separation mechanisms, the machine provides smooth, burr-free cuts and maintains consistent board dimensions, ensuring that each PCB is fully prepared for downstream assembly, functional testing, or quality inspection. Its controlled operation is particularly valuable for fine-pitch, high-density assemblies, where even minor mechanical stress can compromise component reliability or electrical performance.

By automating what is traditionally a manual task, the 자동 솔더 틴 분리기 YTS-850(3) accelerates production cycles, reduces labor requirements, and minimizes human error. The system delivers repeatable separation quality, supporting stable yields and consistent product performance across high-volume manufacturing runs.

Engineered for integration into automated SMT lines, the machine can be positioned seamlessly after soldering, AOI inspection, or functional testing stations. Its enclosed and ergonomic design enhances operator safety by limiting contact with sharp PCB edges and cutting tools, while also reducing workplace hazards and potential damage to components.

요약하자면, 자동 솔더 틴 분리기 YTS-850(3) provides manufacturers with a professional-grade solution that combines high-precision depaneling, reliable component protection, and streamlined workflow, making it indispensable for achieving consistent quality and efficiency in large-scale SMT PCB production.

SMT PCB Separator Machine

How the SMT PCB Separator Machine Is Applied in LED and Lighting PCB Assembly

  • High-Precision Panel Separation
    The machine efficiently separates multi-up LED and lighting PCB panels into individual boards, delivering smooth, burr-free edges while maintaining dimensional accuracy for downstream processes.

  • Component and Solder Joint Protection
    Designed to minimize mechanical stress, the SMT PCB Separator Machine safeguards delicate LED chips, resistors, and other surface-mount components, reducing the risk of board flexing, pad lifting, or solder joint failure.

  • Versatility for Various Board Types
    The system handles a wide range of PCB sizes, thicknesses, and layer configurations typical of LED and lighting applications, including boards with heavy copper or thermal management layers.

  • Enhanced Throughput for High-Volume Production
    Automated depaneling accelerates the separation process, reduces reliance on manual handling, and supports continuous operation for large-scale LED and lighting PCB manufacturing.

  • Consistent and Repeatable Results
    By ensuring uniform cutting and precise separation for every board, the machine improves downstream assembly quality, soldering reliability, and overall product consistency.

  • Seamless Line Integration and Workflow Optimization
    The SMT PCB Separator Machine integrates easily after reflow soldering, AOI, or functional testing, facilitating uninterrupted production flow and contributing to optimized SMT line efficiency.

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명세서

모델 YSM-300
PCB 크기(특수 크기 선택 가능) 300*350mm
PCB 두께 0.3~6.0mm
운영 및 데이터 저장 PC 시스템
차원 1930*1350*1700mm
무게 1100kg
집진기
먼지 수집 방법 진공청소
진공청소기의 공기량 12~20cm3/분
진공청소기 크기 750*600*620mm
집진기의 전압 380V, 50/60Hz, 1.2kW

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