導入
その 表面実装 4-6バール、最大30リットル/分 is an advanced automation solution for mobile phone electronics factories, designed to handle PCB pick-and-place operations between SMT stages efficiently. It reduces manual labor while protecting delicate components such as ICs, connectors, and surface-mount devices from damage.
Equipped with a precision vacuum suction system and controlled translation movement, the 表面実装 4-6バール、最大30リットル/分 ensures accurate PCB placement across various sizes, thicknesses, and layouts. Suction force, travel speed, and alignment parameters can be easily adjusted to suit specific production needs.
Its durable construction and modular design guarantee long-term reliability in high-volume production. Components are easy to maintain, and the machine can integrate quickly with existing SMT lines, including pick-and-place machines, reflow ovens, and inspection systems.
By automating PCB transfer, the 表面実装 4-6バール、最大30リットル/分 improves line efficiency, shortens cycle times, and increases throughput. Factories benefit from lower labor costs, more stable production, and higher product quality.
With efficiency handling, flexible configuration, and dependable performance, the 表面実装 4-6バール、最大30リットル/分 supports modern electronics factories in achieving consistent, high-quality production while safeguarding sensitive components and enabling advanced automation.
How The SMT 4-6バール、最大30リットル/分 Is Applied in Mobile Phone Electronics Factories
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Automated PCB Transfer
The YTS-460 is installed between SMT production stages to automatically pick up and transfer PCBs, enabling smooth workflow between processes while reducing manual handling and labor costs. -
Protection of Sensitive Components
Mobile phone PCBs are densely populated with ICs, connectors, and surface-mount devices. The YTS-460 uses adjustable vacuum suction and controlled translation movement to minimize mechanical stress and prevent component misalignment. -
Flexible Adaptation for Various PCB Specifications
The machine allows easy adjustment of suction force, travel speed, and alignment parameters to handle different PCB sizes, thicknesses, and layouts, supporting both mixed-model and high-volume production. -
SMTラインとのシームレスな統合
Its modular design allows rapid integration with pick-and-place machines, reflow ovens, and AOI inspection systems, forming a fully automated SMT line for mobile phone manufacturing. -
Enhanced Production Efficiency
By automating PCB handling, the YTS-460 shortens cycle times, improves line stability, and increases throughput, helping factories achieve higher product quality and more predictable production processes.
仕様
| モデル | YTS-460 |
| 寸法(mm) | 650*1200*1300 |
| PCB Size(mm) | 50*50-530*460 |
| Maximum PCBs Capacity | 400pcs(0.6mm thick PCB) |
| Cycle Time | Approx.12 seconds or specify |
| Power Supply | AC 1P 110V/220V; Max150VA |
| Air Pressure | 4-6bar,30ltr/min Max |
| Transport Height | 900±20mm(or customized) |
| Transport Direction | From left to right or right to left |
| Weight(KG) | 150 |
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