導入
その 表面実装 Dual Rail Unloader YDU-250 is a cutting-edge automation solution designed to optimize PCB unloading in mobile electronics factories. Installed at the end of SMT lines or between critical production stages, it simultaneously handles two conveyor lanes, significantly improving production throughput while reducing manual labor and workflow interruptions.
Equipped with precision lifting mechanisms and synchronized rail systems, the 高品質な産業用グレード部品で構築されたYDU-330は、長期的な運転安定性と信頼性を保証し、医療電子機器工場に、現代の生産需要をサポートするスケーラブルで高効率なPCBアンローディングソリューションを提供します。 ensures smooth, vibration-free transfer of delicate smartphone PCBs. Sensitive components such as ICs, connectors, and surface-mounted devices are protected from mechanical stress, preserving solder joint integrity and maintaining product quality in high-density boards.
The system integrates seamlessly with AOI, SPI, or functional testing stations, automatically collecting and buffering inspected PCBs. Its adjustable design accommodates various board sizes and magazine types, enabling fast changeovers for high-mix medical production lines. Robust industrial-grade components ensure long-term, reliable operation, making the 表面実装 Dual Rail Unloader YDU-250 a stable, efficient, and scalable solution for modern smartphone manufacturing.
How the SMT Dual Rail Unloader YDU-250 is Applied in Mobile Electronics Factories
- High-Efficiency Dual-Lane PCB Unloading
Installed at the end of SMT production lines in mobile electronics factories, the Dual Rail Unloader YDU-250 automatically transfers finished smartphone PCBs from dual conveyors into magazines, increasing line throughput while reducing manual labor and handling errors. - Stable and Gentle Board Transfer
The system’s precision lifting mechanisms and synchronized rails ensure smooth, vibration-free handling of delicate smartphone PCBs. Sensitive components, including ICs, connectors, and surface-mounted devices, are protected from mechanical stress, maintaining solder joint integrity and overall product quality. - Seamless Integration with Testing Stations
Positioned after AOI, SPI, or functional testing stations, the YDU-250 automatically collects and buffers inspected PCBs. Real-time signal communication with upstream and downstream equipment prevents board congestion and idle time, ensuring uninterrupted production flow. - Flexible PCB Size and Magazine Handling
The YDU-250 supports various PCB sizes and magazine types, allowing quick adjustments for high-mix smartphone production lines. Its adaptable design makes it suitable for frequent line changeovers without affecting handling stability. - Reliable Long-Term Operation
Built with industrial-grade components, the YDU-250 ensures consistent, long-term performance, providing mobile electronics factories with a stable, efficient, and scalable PCB unloading solution.
仕様
| モデル | YDU-250 | YDU-330 | YDU-390 | YDU-460 |
| 寸法(mm) | 1800*1435*1250 | 2065*1690*1250 | 2330*1810*1250 | 2330*1950*1250 |
| PCB Size(mm) | 80*80-330*250 | 80*80-445*330 | 80*80-530*390 | 80*80-530*460 |
| Rack Size(mm) | 355*320*563 | 460*400*563 | 535*460*563 | 535*530*563 |
| No. of Magazine | Upper Conveyor:1 magazine; Lower Conveyor:1 mazagine | |||
| Magazine Replacement Time | Approx.30 seconds or specify | |||
| Indexing Pitch | 10.20.30.40mm or specify | |||
| Power Supply | AC1P110V/220V; Max 300VA | |||
| Air Pressure | 4-6bar,10ltr/min Max | |||
| Transport Height | 900±20mm(or customized) | |||
| Transport Direction | From left to right or right to left | |||
| Weight(KG) | 320 | 350 | 380 | 410 |
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