導入
その 自動PCBはんだ付けロボットマシン YCR-500 is a state-of-the-art solution designed for precision soldering in modern SMT production environments. Engineered with advanced motion control systems and integrated vision-guided alignment, the YCR-500 ensures accurate solder joint formation, consistent thermal profiles, and reliable performance across a wide range of PCBA types. Its non-contact, automated process reduces mechanical stress and minimizes the risk of component damage, delivering high-quality results for complex board assemblies.
Equipped with intelligent adaptive soldering algorithms, the 自動PCBはんだ付けロボットマシン YCR-500 can automatically adjust parameters such as temperature, solder flow, and movement speed according to component type, board density, and layout complexity. The vision-assisted system enables automatic component recognition and dynamic path compensation, ensuring precise soldering even on fine-pitch and high-density PCBs. This level of automation enhances repeatability and significantly reduces production defects.
The soldering robot machine YCR-500 supports a fully automated workflow including board loading, soldering, and unloading, reducing manual labor and optimizing production efficiency. Operators can leverage the user-friendly interface for recipe management, real-time monitoring, and fault diagnostics, ensuring traceability and precise control over the soldering process.
Designed for diverse PCB materials, including rigid, flexible, and hybrid boards, the 自動PCBはんだ付けロボットマシン YCR-500 is suitable for industries such as consumer electronics, automotive modules, telecommunications, and IoT devices. Its precise motion control and temperature management guarantee consistent solder quality, minimize rework, and improve yield rates.
With a combination of automation, accuracy, and reliability, the 自動PCBはんだ付けロボットマシン YCR-500 provides a comprehensive solution for manufacturers seeking to enhance SMT line efficiency, achieve high-quality soldering results, and maintain competitive production standards in advanced electronics manufacturing.

主な特徴
- High-Precision Soldering Control
The soldering robot machine YCR-500 utilizes advanced motion control and temperature regulation systems to deliver precise, uniform solder joints. Its accuracy ensures consistent soldering quality for fine-pitch components, high-density PCBs, and complex board assemblies, minimizing defects and enhancing reliability. - Vision-Guided Component Alignment
Equipped with an integrated vision system, the machine automatically detects component positions, compensates for board deviations, and dynamically adjusts soldering paths. This guarantees repeatable accuracy and reduces alignment errors in multi-layer and mixed-material PCBAs. - Fully Automated Workflow
Supporting automated loading, soldering, and unloading, the soldering robot machine YCR-500 reduces manual intervention, optimizes production efficiency, and enables continuous multi-shift operations. This seamless workflow improves throughput and minimizes human error in high-volume manufacturing. - Adaptive Soldering Algorithms
Intelligent software adjusts soldering parameters such as temperature, solder flow, and movement speed based on board type and component density. This adaptability ensures optimal joint quality, protects sensitive components, and reduces rework rates. - Broad PCB and Component Compatibility
The soldering robot machine YCR-500 accommodates rigid, flexible, and hybrid PCBs, handling a wide range of component sizes and types. Its versatility makes it suitable for consumer electronics, automotive modules, telecommunications, and IoT applications. - Real-Time Monitoring and Process Management
Advanced process-control software provides real-time monitoring, fault detection, and recipe management. Operators can track production performance, optimize soldering parameters, and maintain traceability, ensuring consistent quality and efficient line management.
仕様
| モデル | YSR-300 | YSR-500 | YSR-250A | YSR-250B |
| プラットフォーム番号 | 1 | 1 | 2 | 2 |
| ヘッド番号 | 1 | 2 | 1 | 2 |
| Heating Power | 150w | 300w | 150w | 300w |
| Max. PCB Size | 300*300mm | 500*300mm | 250*250mm | 250*250mm |
| for each Platform | for each Platform | |||
| Max Move Speed | Steel wire and air pressure (Optional: Rotating Brush Clean) |
Steel wire and air pressure (Optional: Rotating Brush Clean) |
Steel wire and air pressure (Optional: Rotating Brush Clean) |
Steel wire and air pressure (Optional: Rotating Brush Clean) |
| Solder Wire | Φ0.6~1.2mm solder wire | Φ0.6~1.2mm solder wire | Φ0.6~1.2mm solder wire | Φ0.6~1.2mm solder wire |
| Solder Feeding Speed | 1~50mm/s | 1~50mm/s | 1~50mm/s | 1~50mm/s |
| Repeated Accuracy | ±0.02mm | ±0.02mm | ±0.02mm | ±0.02mm |
| Temperature Range | Room temperature-500C° | Room temperature-500C° | Room temperature-500C° | Room temperature-500C° |
| Temperature Accuracy | ±1°C | ±1°C | ±1°C | ±1°C |
| Driving Mode | Step Motor | Step Motor | Step Motor | Step Motor |
| 制御モード | Teach Pendant | Teach Pendant | Teach Pendant | Teach Pendant |
| 寸法 | 750*650*880mm | 780*660*770mm | 930*650*880mm | 1280*750*950mm |
| 重さ | Approx 65kg | Approx 70kg | Approx 80kg | Approx 85kg |
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