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SMT Tray Cleaning Machine YC-1000

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説明: 表面実装 トレイ洗浄機 YC-1000 is engineered to deliver fast, consistent, and high-precision cleaning for SMT, semiconductor, and electronics handling trays. Its optimized brushing and airflow extraction system effectively removes dust, fibers, and micro-contaminants without damaging the tray structure. Designed for stable operation and easy maintenance, the YC-1000 supports multiple tray sizes and high-throughput production environments. It helps manufacturers maintain clean material flow, reduce contamination risks, and ensure reliable quality throughout the assembly process.

最小注文数量:1個

リードタイム:15日

導入

その 表面実装 トレイ洗浄機 YC-1000 is designed to meet the increasing cleanliness standards of modern SMT, semiconductor, and precision assembly environments. Its advanced cleaning module integrates soft-contact brushing, guided airflow, and high-efficiency particle extraction to remove dust, fibers, and residual contaminants from trays without causing abrasion or deformation. With its stable mechanical structure and optimized processing path, the YC-1000 ensures uniform cleaning results even under long-duration, high-volume operation.

To support diverse manufacturing workflows, the 表面実装 トレイ洗浄機 YC-1000 accommodates a wide range of tray sizes and materials, making it adaptable to mixed-model production lines. Its fully automated loading, cleaning, and unloading sequence minimizes manual intervention and significantly improves operational efficiency. The enclosed cleaning zone and well-controlled exhaust system also help maintain cleaner environments, especially in cleanroom-level processes.

Maintenance is simplified through tool-free access points, durable components, and long-life consumables, allowing technicians to perform quick checks and replacements with minimal downtime. By combining reliable performance, easy integration, and superior contamination control, the 表面実装 トレイ洗浄機 YC-1000 provides manufacturers with a highly efficient and consistent solution for improving product yield and maintaining cleaner production standards.

SMT Tray Cleaning Machine

主な特徴

  • Enhanced Multi-Stage Cleaning System
    The YC-1000 utilizes a coordinated combination of precision brushing, controlled airflow sweeping, and high-efficiency extraction to remove layered dust and micro-particles from trays. This multi-stage approach ensures thorough cleanliness, making it suitable for sensitive SMT and semiconductor applications.

  • Adaptive Tray Size Handling
    Engineered with an adjustable alignment mechanism, the machine supports a wide spectrum of tray formats without requiring complex changeovers. This flexibility enables operators to switch between different product types quickly, maintaining smooth flow in dynamic production lines.

  • Stable and Repeatable Cleaning Quality
    With reinforced structural integrity and carefully balanced cleaning pressure, the YC-1000 delivers uniform results across every cycle. Its consistent performance helps manufacturers reduce contamination risks and achieve predictable quality in high-volume operations.

  • High-Throughput Automation
    The machine integrates automated feeding, cleaning, and discharge functions to streamline workflow. This reduces manual handling, accelerates tray turnover, and enhances productivity for facilities operating under tight cycle-time requirements.

  • Low-Maintenance Architecture
    Designed with user convenience in mind, the YC-1000 features easy-access panels, robust wear-resistant components, and simplified inspection paths. These elements help reduce service time and extend equipment life in demanding production environments.

  • Cleanroom-Compatible Operation
    An enclosed cleaning chamber combined with an efficient dust-capture system minimizes particle dispersion. This ensures that tray cleaning contributes positively to overall cleanliness management, supporting high-end manufacturing processes that require controlled environments.

 

 

仕様

アイテム YC-1000
洗浄バスケットのサイズ Φ1000mm x H 200mm。特殊サイズオプション
スプレーユニット Φ1000mm x H 200mm。特殊サイズオプション
スプレーユニット 上部/下部/前面、720°全周スプレー
3段階フィルターシステム 1mm /50um/20umフィルター
圧縮空気圧 0.5~0.7MPa
クリーンタンク容量 80L
すすぎ水の温度 室温〜80
熱風温度 室温〜90
クリーンポンプパワー 2.2kW
クリーンな洗剤力 9kW
送風機の電力 4.0kW
電源 3P、AC 380V、50/60HZ、33KW
機械サイズ 長さ1380×幅2100×高さ1400(mm)

 

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