Equipped with precision cleaning mechanisms, the system removes micro-debris efficiently without damaging the nozzle tip. Its multi-stage cleaning design combines controlled brushing, suction, and optional ultrasonic action, delivering thorough results for various nozzle types and sizes. By preventing residue buildup, it enhances the reliability of component placement and minimizes the risk of misalignment or soldering defects.<\/p>\n
Designed for seamless integration into SMT production lines, the Nozzle Cleaning Machine operates automatically with minimal human intervention. Smart handling and programmable cleaning cycles ensure consistency, allowing manufacturers to maintain high-speed operations while safeguarding the quality of every pick-and-place cycle. Its compact footprint and user-friendly interface make it suitable for both small workshops and large-scale factories.<\/p>\n
IL Macchina per la Pulizia degli Ugelli SMT YC-665<\/strong> is compatible with nozzles used in consumer electronics, automotive boards, industrial control PCBs, and other precision assemblies. By providing stable, repeatable cleaning performance, it extends nozzle lifespan, enhances overall equipment efficiency, and supports consistent high-quality manufacturing. The Nozzle Cleaning Machine is an essential tool for electronics manufacturers aiming to optimize SMT line productivity and reliability.<\/p>\n High-Precision Nozzle Cleaning<\/strong> Automated Operation<\/strong> Sistema di pulizia multistadio<\/strong> Smart Process Monitoring<\/strong> Compatibility with Various Nozzle Types<\/strong> Improved Equipment Longevity<\/strong> <\/p>\n <\/p>\n![\"SMT\u00a0Nozzle](\"https:\/\/esmte.com\/wp-content\/uploads\/2025\/12\/11-12.webp\")
<\/p>\nCaratteristiche principali<\/h3>\n
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Effectively removes solder paste residues, dust, and micro-debris from SMT pick-and-place nozzles, ensuring consistent component placement and reliable soldering quality.<\/p>\n<\/li>\n
Fully automated loading, cleaning, and unloading processes reduce manual handling, minimize human error, and stabilize production efficiency.<\/p>\n<\/li>\n
Combines brushing, suction, and optional ultrasonic cleaning to achieve thorough results without damaging delicate nozzle tips.<\/p>\n<\/li>\n
Equipped with sensors and programmable cycles to track cleaning performance in real time, allowing adjustments for optimal cleaning outcomes.<\/p>\n<\/li>\n
Supports multiple nozzle sizes and designs used in consumer electronics, automotive PCBs, and industrial boards, making it versatile for different production lines.<\/p>\n<\/li>\n
Regular and precise cleaning reduces wear and tear on nozzles, prolonging their lifespan and maintaining consistent SMT line productivity.<\/p>\n<\/li>\n<\/ul>\nSpecifiche<\/h2>\n
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\n Modello<\/td>\n YC-665<\/td>\n<\/tr>\n \n Fornitura d'aria<\/td>\n 0,5~0,7 MPa<\/td>\n<\/tr>\n \n Alimentazione elettrica<\/td>\n 17L<\/td>\n<\/tr>\n \n Liquido pulito<\/td>\n Acqua purificata o acqua deionizzata<\/td>\n<\/tr>\n \n Tempo pulito<\/td>\n 2~3 minuti<\/td>\n<\/tr>\n \n Tempo di asciugatura<\/td>\n 1~3 minuti<\/td>\n<\/tr>\n \n pressione del getto<\/td>\n \u22640,55 MPa<\/td>\n<\/tr>\n \n Consumo di acqua<\/td>\n \u2264150cc\/ora<\/td>\n<\/tr>\n \n Gamma di ugelli<\/td>\n Min 01005~Max inner diameter\u00a0\uffe02.0mm<\/td>\n<\/tr>\n \n Specifiche del Jig<\/td>\n I.C.T-24:Small nozzle 24 holes \/big nozzle 12 holes<\/td>\n<\/tr>\n \n I.C.T-36:Small nozzle 36 holes \/big nozzle 12 holes<\/td>\n<\/tr>\n \n Dimensioni della macchina<\/td>\n L665 x P555 x A475 (mm)<\/td>\n<\/tr>\n \n Peso della macchina<\/td>\n 40 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n