The machine features a multi-stage cleaning system that combines brushing, suction, and optional ultrasonic cleaning to remove residues effectively without damaging delicate nozzle tips. Its programmable cleaning cycles allow customization for different nozzle sizes and types, ensuring thorough cleaning across a wide range of SMT components. By preventing residue buildup, the YC-665 enhances component placement accuracy, reduces defects, and improves overall production yield.<\/p>\n
Designed for seamless integration into SMT lines, the SMT\u00a0Nozzle Cleaning Machine YC-665<\/strong> operates automatically with minimal human intervention. Its smart handling system manages loading, cleaning, and unloading, maintaining consistent cleaning performance even in high-volume operations. The compact footprint and user-friendly interface make it suitable for both small workshops and large-scale manufacturing facilities.<\/p>\n Compatible with nozzles used in consumer electronics, automotive PCBs, and industrial control boards, the SMT\u00a0Nozzle Cleaning Machine YC-665<\/strong> is a versatile solution for modern SMT production. By providing repeatable, high-quality cleaning, it prolongs nozzle life, stabilizes production processes, and supports the manufacture of reliable, high-performance electronic devices.<\/p>\n Precision Nozzle Cleaning<\/strong> Teljesen automatiz\u00e1lt m\u0171k\u00f6d\u00e9s<\/strong> Multi-Stage Cleaning Technology<\/strong> Programmable Cleaning Cycles<\/strong> High-Speed SMT Line Compatibility<\/strong> Enhanced Nozzle Longevity<\/strong> <\/p>\n![\"SMT](\"https:\/\/esmte.com\/wp-content\/uploads\/2025\/12\/11-12.webp\")
<\/p>\nF\u0151bb jellemz\u0151k<\/h3>\n
\n
The YC-665 efficiently removes solder paste residues, dust, and micro-debris from SMT pick-and-place nozzles, ensuring accurate component placement and stable soldering quality.<\/p>\n<\/li>\n
Automated loading, cleaning, and unloading reduce manual handling, minimize human error, and maintain consistent production efficiency.<\/p>\n<\/li>\n
Combines brushing, suction, and optional ultrasonic cleaning to thoroughly clean nozzles without causing damage to delicate tips.<\/p>\n<\/li>\n
Customizable cycles allow operators to adjust cleaning parameters for different nozzle sizes and types, ensuring optimal cleaning performance.<\/p>\n<\/li>\n
Designed for integration into high-volume SMT production lines, the YC-665 maintains cleaning consistency without slowing down the workflow.<\/p>\n<\/li>\n
Regular and precise cleaning prevents residue buildup, extending nozzle lifespan and improving the overall reliability of SMT pick-and-place operations.<\/p>\n<\/li>\n<\/ul>\nSpecifik\u00e1ci\u00f3k<\/h2>\n
\n\n
\n Modell<\/td>\n YC-665<\/td>\n<\/tr>\n \n Leveg\u0151ell\u00e1t\u00e1s<\/td>\n 0,5~0,7 MPa<\/td>\n<\/tr>\n \n T\u00e1pegys\u00e9g<\/td>\n 17 literes<\/td>\n<\/tr>\n \n Tiszta folyad\u00e9k<\/td>\n Tiszt\u00edtott v\u00edz vagy desztill\u00e1lt v\u00edz<\/td>\n<\/tr>\n \n Tiszta id\u0151<\/td>\n 2~3 perc<\/td>\n<\/tr>\n \n Sz\u00e1rad\u00e1si id\u0151<\/td>\n 1~3 perc<\/td>\n<\/tr>\n \n Sug\u00e1rnyom\u00e1s<\/td>\n \u22640,55 MPa<\/td>\n<\/tr>\n \n V\u00edzfogyaszt\u00e1s<\/td>\n \u2264150cc\/\u00f3ra<\/td>\n<\/tr>\n \n F\u00fav\u00f3kav\u00e1laszt\u00e9k<\/td>\n Min 01005~Max inner diameter\u00a0\uffe02.0mm<\/td>\n<\/tr>\n \n Jig specifik\u00e1ci\u00f3<\/td>\n I.C.T-24:Small nozzle 24 holes \/big nozzle 12 holes<\/td>\n<\/tr>\n \n I.C.T-36:Small nozzle 36 holes \/big nozzle 12 holes<\/td>\n<\/tr>\n \n G\u00e9p m\u00e9rete<\/td>\n H665 \u00d7 Sz555 \u00d7 M475 (mm)<\/td>\n<\/tr>\n \n G\u00e9p s\u00falya<\/td>\n 40 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n