Bevezetés
Nagy Sebességű Pick & Place Gép supports advanced smartphone assembly by delivering automated and accurate PCB rotation across SMT stages. This reduces dependency on manual handling and ensures that microchips, camera modules, and other delicate components are oriented correctly for soldering and inspection. By controlling board movement precisely, the system enhances overall product reliability and reduces defect rates for high-density smartphone PCBs.
A Nagy Sebességű Pick & Place Gép’s compact yet robust design allows installation in high-density SMT lines without interfering with other equipment. Its smooth, controlled motion safeguards sensitive electronics from vibration and mechanical impact, while adjustable settings accommodate multiple board sizes, thicknesses, and component layouts. This makes it ideal for factories producing diverse smartphone models or rapidly changing product lines.
Integrated with upstream and downstream SMT machinery, the Nagy Sebességű Pick & Place Gép maintains continuous production flow, prevents bottlenecks, and reduces line stoppages. Real-time monitoring and stable mechanical performance allow factories to sustain long production cycles with predictable output. By combining automation, protective handling, and flexible adaptability, the YTO-350 empowers smartphone manufacturers to maximize throughput, improve assembly quality, and enhance overall operational efficiency.
Applications of the High Quality SMT Turning Over Conveyor YTO-350 in Smartphone Electronics Manufacturing
1. Controlled Rotation for Complex PCBs
A Nagy Sebességű Pick & Place Gép handles multi-layer smartphone boards accurately, preparing them for secondary placement, inspection, and soldering stages.
2. Safe Handling for High-Value Modules
Camera units, AI chips, and connectors remain secure during flipping, minimizing damage and reducing rework costs.
3. Integration into High-Density Lines
The conveyor fits into tight production areas without blocking other SMT equipment, allowing factories to expand output in limited spaces.
4. Rapid Line Reconfiguration
Operators can adjust rotation parameters for different board formats and layouts, supporting flexible smartphone manufacturing.
5. Continuous Throughput Management
Dynamic board staging prevents accumulation at any point in the line, ensuring steady production flow and maximizing throughput.
6. Reliable Performance Over Extended Runs
Robust construction and stable motion control maintain consistent flipping accuracy for long production cycles, improving operational efficiency and reducing downtime.
Specifikációk
| Modell | YTO-350 | YTO-460 |
| Méret (mm) | 600*600*1200 | 750*750*1200 |
| PCB Size(mm) | 50*50-400*350 | 50*50-530*460 |
| Cycle Time | Approx. 15 seconds | |
| Belt Type | Round Belt or Oblate Belt | |
| Tápegység | AC 1P 110V/220V; Max 250VA | |
| Transport Height | 900±20mm(or customized) | |
| Transport Direction | From left to right or right to left | |
| Weight(KG) | 170 | 220 |
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