Equipped with precision lifting mechanisms and synchronized rail systems, the SMT Dual Rail Unloader YDU-250<\/strong> ensures smooth, vibration-free transfer of delicate smartphone PCBs. Sensitive components such as ICs, connectors, and surface-mounted devices are protected from mechanical stress, preserving solder joint integrity and maintaining product quality in high-density boards.<\/p>\n The system integrates seamlessly with AOI, SPI, or functional testing stations, automatically collecting and buffering inspected PCBs. Its adjustable design accommodates various board sizes and magazine types, enabling fast changeovers for high-mix medical production lines. Robust industrial-grade components ensure long-term, reliable operation, making the SMT<\/strong> Construido con componentes de grado industrial, el YDU-250 garantiza un rendimiento constante y duradero, ofreciendo a las f\u00e1bricas de electr\u00f3nica m\u00f3vil una soluci\u00f3n estable, eficiente y escalable para la descarga de PCB.<\/strong> a stable, efficient, and scalable solution for modern smartphone manufacturing.<\/p>\n <\/p>\n <\/p>\n <\/p>\n <\/p>\n <\/p>\n![\"SMT](\"https:\/\/esmte.com\/wp-content\/uploads\/2026\/01\/Dual-Rail-Unloader.webp\")
<\/p>\nHow the SMT Dual Rail Unloader YDU-250 is Applied in Mobile Electronics Factories<\/strong><\/h2>\n
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Installed at the end of SMT production lines in mobile electronics factories, the Dual Rail Unloader YDU-250 automatically transfers finished smartphone PCBs from dual conveyors into magazines, increasing line throughput while reducing manual labor and handling errors.<\/li>\n
The system\u2019s precision lifting mechanisms and synchronized rails ensure smooth, vibration-free handling of delicate smartphone PCBs. Sensitive components, including ICs, connectors, and surface-mounted devices, are protected from mechanical stress, maintaining solder joint integrity and overall product quality.<\/li>\n
Positioned after AOI, SPI, or functional testing stations, the YDU-250 automatically collects and buffers inspected PCBs. Real-time signal communication with upstream and downstream equipment prevents board congestion and idle time, ensuring uninterrupted production flow.<\/li>\n
The YDU-250 supports various PCB sizes and magazine types, allowing quick adjustments for high-mix smartphone production lines. Its adaptable design makes it suitable for frequent line changeovers without affecting handling stability.<\/li>\n
Built with industrial-grade components, the YDU-250 ensures consistent, long-term performance, providing mobile electronics factories with a stable, efficient, and scalable PCB unloading solution.<\/li>\n<\/ul>\n![\"SMT](\"https:\/\/esmte.com\/wp-content\/uploads\/2026\/01\/Picture-3.webp\")
<\/p>\nPresupuesto<\/h2>\n
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\n Modelo<\/td>\n YDU-250<\/td>\n YDU-330<\/td>\n YDU-390<\/td>\n YDU-460<\/td>\n<\/tr>\n \n Dimensi\u00f3n (mm)<\/td>\n 1800*1435*1250<\/td>\n 2065*1690*1250<\/td>\n 2330*1810*1250<\/td>\n 2330*1950*1250<\/td>\n<\/tr>\n \n PCB\u00a0Size(mm)<\/td>\n 80*80-330*250<\/td>\n 80*80-445*330<\/td>\n 80*80-530*390<\/td>\n 80*80-530*460<\/td>\n<\/tr>\n \n Rack\u00a0Size(mm)<\/td>\n 355*320*563<\/td>\n 460*400*563<\/td>\n 535*460*563<\/td>\n 535*530*563<\/td>\n<\/tr>\n \n No.\u00a0of\u00a0Magazine<\/td>\n Upper\u00a0Conveyor:1\u00a0magazine;\u00a0Lower\u00a0Conveyor:1\u00a0mazagine<\/td>\n<\/tr>\n \n Magazine\u00a0Replacement\u00a0Time<\/td>\n Approx.30\u00a0seconds\u00a0or\u00a0specify<\/td>\n<\/tr>\n \n Indexing\u00a0Pitch<\/td>\n 10.20.30.40mm\u00a0or\u00a0specify<\/td>\n<\/tr>\n \n Power\u00a0Supply<\/td>\n AC1P110V\/220V;\u00a0Max\u00a0300VA<\/td>\n<\/tr>\n \n Air\u00a0Pressure<\/td>\n 4-6bar,10ltr\/min\u00a0Max<\/td>\n<\/tr>\n \n Transport\u00a0Height<\/td>\n 900\u00b120mm(or\u00a0customized)<\/td>\n<\/tr>\n \n Transport\u00a0Direction<\/td>\n From\u00a0left\u00a0to\u00a0right\u00a0or\u00a0right\u00a0to\u00a0left<\/td>\n<\/tr>\n \n Weight(KG)<\/td>\n 320<\/td>\n 350<\/td>\n 380<\/td>\n 410<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n