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SMT Translational Conveyor YTC-330
Beschreibung: Die SMT Translational Conveyor YTC-330 Ermöglicht einen konsistenten, zuverlässigen Leiterplattenfluss und erfüllt die Anforderungen moderner Smartphone-Elektronikfabriken.
Mindestbestellmenge: 1 Stück
Lieferzeit: 15 Tage
Einführung
Der SMT Translational Conveyor YTC-330 is engineered to provide stable lateral PCB transfer for modern smartphone SMT production lines. Its sideways movement capability enables PCBs to be transferred smoothly between offset or parallel machines, facilitating continuous operation across printers, pick-and-place machines, AOI units, and reflow ovens. This design supports high-speed, high-mix production environments common in smartphone electronics factories.
By maintaining precise board alignment during transfer, the YTC-330 reduces handling errors, misplacement, and process interruptions. It accommodates various PCB types, from mainboards to camera modules and display drivers, ensuring that delicate components remain intact. Automated lateral movement decreases the need for manual intervention, helping factories maintain a consistent throughput while minimizing operational downtime.
Der SMT Translational Conveyor YTC-330’s flexible design allows it to be easily integrated into existing SMT lines without requiring significant modifications. It optimizes floor space and enables adaptive production line layouts to meet evolving smartphone manufacturing needs. By combining reliable lateral transfer with automation-friendly features, the conveyor enhances overall production stability, supports efficient line balancing, and ensures predictable, high-quality output in fast-paced smartphone assembly operations.
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Balances Production Loads Across SMT Lines
Redistributes PCBs laterally between parallel production lines to optimize capacity utilization in smartphone factories. -
Supports Smart Line Control Integration
Works with line control systems to dynamically route PCBs based on process availability. -
Facilitates Scalable Line Design
Enables future expansion or reconfiguration without major mechanical adjustments. -
Improves Multi-Product Manufacturing Efficiency
Maintains stable throughput when producing multiple smartphone models on a single SMT floor. -
Ensures Smooth Handover Between Production Sections
Reduces congestion and bottlenecks through controlled lateral PCB transfer. -
Supports High Automation Requirements
Enables consistent, reliable PCB flow, meeting modern smartphone electronics factory demands.
Spezifikationen
| Modell | YTC-330（Single Station） | YTC-450A（Single Station） | YTC-450B（Double Stations） |
| Abmessung (mm) | 500*W*1050 | 500*W*1050 | 500*W*1050 |
| Machine Width | (1000mm) Depends on traversing distance |
(1500mm) Depends on traversing distance |
(1500mm) Depends on traversing distance |
| PCB Size(mm) | 50*50-330*350 | 50*50-450*350 | 50*50-450*350 |
| Cycle Time | Depends on traversing distance | ||
| Belt Type | Rround Belt or Oblate Belt | ||
| Stromversorgung | AC 1P 110V/220V; Max 250VA | ||
| Transport Height | 900±20mm(or customized) | ||
| Transport Direction | From left to right or right to left | ||
| Weight(KG) | 120 | 140 | 140 |
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